Call for Papers
Submit your research for ICLD 2027
Conference Theme
Technology in Language Education and Research
We welcome submissions from researchers, educators, and practitioners sharing emerging trends and methods in applying technology to language teaching, learning, and research.
Conference Topics
We welcome submissions on, but not limited to, the following sub-topics:
- Teaching and Learning Foreign/Second Languages
- Language Acquisition and Development
- English as a Medium of Instruction (EMI)
- English for Academic Purposes (EAP) and English for Specific Purposes (ESP)
- Language Assessment and Testing
- Technology in Language Teaching and Learning
- Discourse Analysis and Pragmatics
- Translation and Interpretation Studies
- Literary Analysis
- Sociolinguistics
- Corpus Linguistics
- Intercultural / Cross-cultural Communication
- Language Teacher Education and Professional Development
Important Dates
- Submission Opens: 15 May 2026
- Submission Deadline (full paper): 31 August 2026
- Notification of Acceptance (with revisions): 05 November 2026
- Revised Paper Deadline: 20 November 2026
- Notification of Final Acceptance: 15 December 2026
- Camera-Ready Deadline: 05 January 2027
- Conference Dates: 02–03 July 2027
Submission Guidelines
- Paper types: Research paper, Conceptual paper, Review paper.
- Length: 5,000–6,000 words (including references and appendices).
- Format: Times New Roman, 12 pt.
- Structure (research papers): Title, Abstract, Keywords, Introduction, Literature, Method, Results, Discussion, Conclusion, References.
- Two-stage submission: authors submit an abstract first; full papers are invited only after the abstract is accepted.
- Presentation formats: paper and poster, onsite or online via Zoom.
Why Contribute?
- Be part of a global academic community
- Share your research and ideas
- Contribute to the advancement of language education and research
- Publication opportunity with Springer and Scopus indexing
Submission Portal
All submissions are received through the Springer online system.
Submit via Springer →